In Jin Rongxin’s PCB production, SPI inspection is carried out after each solder paste printing. SPI (Solder Paste Inspection) is an important inspection process. It is specifically used to check the printing condition of solder paste to ensure that the quality of each solder joint meets the standards. Whether it is Surface Mount Technology (SMT) or traditional plug-in assembly, it cannot do without the assistance of SPI. SPI can help us detect the thickness, position, and uniform distribution of solder paste, and also avoid circuit problems caused by welding defects.
Why use SPI?
- Improve soldering quality: By inspecting the solder paste before mounting, SPI can effectively prevent false soldering, insufficient soldering, etc. caused by solder paste printing problems. This can ensure more stable soldering quality of products, reduce the rework rate, and thus improve production efficiency.
- Improve production efficiency: SPI can feed back problems in production in real-time and adjust the production process in a timely manner, thereby avoiding rework caused by incorrect solder paste application and reducing production downtime.
- Reduce waste: The accurate inspection of SPI can reduce losses caused by solder paste quality problems, thereby reducing material waste and costs.
- Ensure printing consistency: SPI can not only check the quality of a single soldering but also conduct batch inspections to ensure that each batch of products can meet consistent soldering standards.
How does SPI work?
The SPI system checks the distribution of solder paste through high-precision and high-resolution scanning equipment. It takes images of the pad surface and combines software for analysis to accurately measure the height, area, and position of the solder paste. If a problem is found, the system will alarm immediately, prompting the operator to make adjustments. In this way, every PCB on the production line can undergo strict inspection to ensure the final product quality.
Summary
Jin Rongxin’s introduction of SPI technology has greatly improved the automation and accuracy of PCB production, not only reducing production costs but also ensuring the consistency and reliability of customers’ products. With the continuous development of intelligent manufacturing, SPI inspection is also constantly upgrading and has become an indispensable part of the PCB assembly process.